Nano-indentation of copper thin films on silicon substrates
نویسندگان
چکیده
منابع مشابه
Nano-indentation of Copper Thin Films on Silicon Substrates
Indentation methods are finding increasing use in the study of mechanical properties of bulk and thin-film materials over a wide range of size scales (e.g., [1,2]). With the increasing sophistication of instrumented, depth-sensing indentation equipment and of computational methods to model the deformation of materials subjected to indentation, there is growing interest in studying the elastopla...
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ژورنال
عنوان ژورنال: Scripta Materialia
سال: 1999
ISSN: 1359-6462
DOI: 10.1016/s1359-6462(99)00245-6